Component source interchange gantry

ABSTRACT

The present invention is a method and apparatus for automatically storing and replenishing expandable wafers used in component feeders used in automated printed circuit board assembly systems, for example the Hover-Davis Direct Die Feeder (DDF). In the mass production of printed circuit boards automated pick-and-place equipment accepts die from “chip feeders” and then mounts them at a predetermined location on the circuit board. The present invention includes a wafer or tape reel storage bay and a gripping assembly that is moved by a gantry robot to retrieve a wafer or reel from the storage bay and automatically deposit it into a component feeder.

CROSS REFERENCE

[0001] The following related patents and co-pending applications arehereby incorporated by reference for their teachings: p1 “WAFERINTERCHANGE GANTRY,” a U.S. Provisional Application for Patent by P.Davis et al., 60/216,855, filed Jul. 7, 2000;

[0002] “METHOD AND APPARATUS FOR REMOVING DIE FROM AN EXPANDED WAFER ANDCONVEYING DIE TO A PICKUP LOCATION,” Peter Davis et al., U.S. Pat. No.5,976,306, issued Nov. 2,1999;

[0003] “METHOD AND APPARATUS FOR REMOVING DIE FROM A WAFER AND CONVEYINGDIE TO A PICKUP LOCATION,” by Peter Davis et al., U.S. application No.09/251,541, filed Feb. 17,1999. (HD-DDF-3); “METHOD AND APPARATUS FORREMOVING DIE FROM A WAFER AND CONVEYING DIE TO A PICKUP LOCATION,” byPeter Davis et al., WO/99/42289 (PCT-US99/03385), filed Feb. 17,1999;

[0004] “DIE SHUTTLE CONVEYOR AND NEST THEREFOR,” by Peter Davis et al.,U.S. patent application No. 09/684,189, filed Oct. 6, 2000 (formerlyU.S. Provisional Application No. 60/158,413, filed Oct. 7,1999); and

[0005] “SELF-THREADING COMPONENT TAPE FEEDER,” by David W. Lyndaker etal., Provisional Application No. 60/293,397, filed May 24, 2001.

[0006] This invention relates generally to an apparatus forautomatically replenishing a component source in an automated componentfeeder such as a surface mount die source, and more particularly to agantry-type apparatus for storing and automatically delivering aplurality of components to a component feeder.

BACKGROUND AND SUMMARY OF THE INVENTION

[0007] The present invention is a component source interchange gantrydesigned to automatically store and replenish semiconductor componentsstored on both wafers used in a direct die feeder such as theHover-Davis Direct Die Feeder (DDF), or in component tape reels employedwith component tape feeders such as the SELF-THREADING COMPONENT TAPEFEEDER (60/293,397) noted above. In the mass production of printedcircuit boards automated pick-and-place equipment generally accept diefrom a tape and reel feeder and/or waffle tray method and subsequentlyplaces them at a predetermined location on the circuit board or similarsubstrate. The direct die feeder or DDF is capable of performing thisfunction of presenting die directly from a wafer without taking upsignificantly more space than a tape feeder. By reducing the handling ofbare die on its journey from wafer to assembly, significant costreduction is realized, and the limited handling mitigates the potentialfor damage to the individual die, thereby enhancing the reliability ofthe end product.

[0008] However, the supply of die to a DDF, via expanded wafers holdingthe die, currently requires human intervention, where a technician ormachine operator is responsible for removing a depleted wafer frame, andreplenishing the feeder with a new or full wafer. Such a process notonly requires labor, but may also result in additional operation costsif the pick-and-place equipment must be shut down or idled during thereplacement of a wafer. Accordingly, the present invention is directedto an apparatus that can preferably store and automatically replenishspent wafers so as to avoid the need for operator intervention and toreduce wafer interchange time and handling. It will be furtherappreciated that similar benefits may be achieved in conventionalcomponent tape feeders were a similar system adapted to automaticallysupply component tape reels to self-threading or auto-loading componenttape feeders.

[0009] In accordance with the present invention, there is provided anapparatus for supplying component storage units to a component feeder,comprising: a frame for positioning the apparatus in juxtaposition withthe component feeder; a storage bay located within the confines of saidframe for storing a plurality of component storage units therein; agripper assembly for gripping one of the plurality of component storageunits stored in said storage bay; and gripper assembly movement meansfor automatically moving the gripper assembly from a position adjacentthe storage bay to a position adjacent the component feeder.

[0010] In accordance with another aspect of the present invention, thereis provided an apparatus for supplying wafers to a direct die feeder,comprising: a frame for positioning the apparatus in juxtaposition witha direct die feeder; a wafer bay located within the confines of saidframe for storing a plurality of wafers therein; a gripper assembly forgripping one of the plurality of expandable wafers stored in the waferbay; and gripper assembly movement means for moving the gripper assemblyfrom a position adjacent the wafer bay to a position adjacent the directdie feeder.

[0011] In accordance with yet another aspect of the present invention,there is provided a method for automatically supplying components to acomponent feeder, comprising the steps of: positioning a collection ofcomponent storage units in a bay in juxtaposition with a componentfeeder; releasably gripping a component storage unit in the bay; andmoving the component storage unit from a position within the bay to aposition adjacent the component feeder to facilitate the automaticinsertion of the component storage unit into the feeder for use.

[0012] In accordance with a further aspect of the present invention,there is provided a method for automatically supplying wafers to adirect die feeder, comprising the steps of: positioning a collection ofwafers in a wafer bay in juxtaposition with a direct die feeder;releasably gripping a wafer stored in the wafer bay; and moving thewafer from a position adjacent the wafer bay to a position adjacent thedirect die feeder to facilitate the automatic insertion of the die intothe feeder for use.

[0013] One aspect of the invention is based on the discovery oftechniques for automatically gripping and transporting wafers andcomponent tape reels from a storage bay to a component feeder such as adirect die feeder. For example, a gantry-type system for providingwafers to a direct die feeder in a surface mount assembly system. Thetechniques implement a robotic or automated feeding operation in orderto handle the wafers in a careful and controlled manners so as toretrieve empty wafer frames and replenish the direct die feeder therebylimiting operator intervention. Moreover, the storage bay of the systemmay include positioning systems for interchangeable wafer or reelmagazines, as well as pre- or post-processing functions.

[0014] The technique described above is advantageous because it isefficient compared to manual, labor-intensive approaches. The techniquesof the invention are advantageous because they provide a range ofalternatives for the fetch and retrieval of components (on wafers orreels) to re-supply the component feeder, each of which is useful inappropriate situations. As a result of the invention, longer term,automated operation of component feeders will be possible.

BRIEF DESCRIPTION OF THE DRAWINGS

[0015]FIGS. 1 and 2 are perspective views of an embodiment of thecomponent interchange gantry system in a closed and an open position,respectively, in accordance with an aspect of the present invention;

[0016]FIG. 3 is a perspective view of a portion of an alternativeembodiment of the component interchange gantry system for use with tapereel component feeders;

[0017]FIG. 4 is a detailed view of components of the system of FIG. 1;

[0018]FIG. 5 is a detailed view of a gripper assembly of the system ofFIG. 1 with a wafer held therein;

[0019]FIG. 6 is a schematic block diagram illustrating variouscomponents of a component interchange gantry system in accordance withthe present invention; and

[0020]FIG. 7 is a flow chart depicting the various steps in theautomated process executed in accordance with an embodiment of thepresent invention.

[0021] The present invention will be described in connection with apreferred embodiment, however, it will be understood that there is nointent to limit the invention to the embodiment described. On thecontrary, the intent is to cover all alternatives, modifications, andequivalents as may be included within the spirit and scope of theinvention as defined by the appended claims.

DESCRIPTION OF THE PREFERRED EMBODIMENT

[0022] For a general understanding of the present invention, referenceis made to the drawings. In the drawings, like reference numerals havebeen used throughout to designate identical elements.

[0023]FIG. 1 depicts a perspective view of an embodiment of thecomponent source interchange gantry 100 in an operating position as itmay be configured for use as a supply of wafers for a direct die feeder.FIG. 2 depicts the same component source interchange gantry in an “open”position where it would allow access to an associated component feeder130. Referring to FIGS. 1 and 2, frame support members 102 and 104 areintended to be integrally affixed to the frame or structure of acomponent pick-and-place assembly system (not shown). Frame member 102preferably includes pivot axis 1 10 and 112 about which the storage bayand gantry frame 114 is hingedly affixed to the member 102. In oneembodiment, the pivots provide a means for moving said gripper andgantry assembly away from the component feeder. On the opposite supportmember 104, the frame 114 is supported, when in a “closed” position, bysupport member 106 that rotateably interferes with and supports thebottom of frame 114 when it is moved to a position adjacent frame member104. Although not shown, it is also possible that gantry frame 114 mayemploy casters or other support mechanisms to support the frame when itis an opened position.

[0024] As an alternative means for moving the gripper assembly andgantry frame 114 away from the component feeder, it is furthercontemplated that the assemblies may be accurately positioned and movedvia a linear mechanism such as a slide or rail-type device (manual orautomated), so as to provide access to the component feeders therebelow. More specifically, the mechanism may slide in either an outwardor an upward direction so as to provide access to the feeders. It willbe further appreciated that a slide or rail system, to provide suchaccess, may require hardware not currently reflected in FIG. 2.

[0025] The component source interchange gantry includes a componentsource storage bay 116 for storing a plurality of component storageunits that have a plurality of components associated therewith (e.g.,wafers or component tape reels) therein. Within the gantry frame 114,and particularly within component source storage bay 116, a plurality ofexpandable (or unexpanded) wafers such as those disclosed and taught inU.S. Pat. No. 5,976,306, previously incorporated by reference, arestored. In particular, a component storage unit such as a wafer ring 140is preferably held in a wafer frame 142, the wafer frame being suitablefor storing the wafer (or more appropriately the die divided therefrom)in a rack or magazine 118 within the wafer bay. Preferably the magazineis comprised of parallel grooves or slots positioned along the top andbottom thereof, and is slidably mounted within component source bay 116so the wafer ring(s) and frame(s) are preferably held in a vertical orupright position, such as a Wafer Frame Magazine made by PerfectionProducts, Inc. (Model # FFM-4263-01) and preferably able to holdapproximately twelve expanded wafer frames therein.

[0026] It will be appreciated that other regions within bay 116 may alsobe used for the staging of wafers awaiting loading as well as used ordepleted wafer frames. Moreover, the other regions within bay 116, forexample regions 117 and 119 may also be used for pre- or post-processingof wafers in conjunction with an aspect of the present invention. Forpre-processing, it is contemplated that a region within the bay may beemployed to provide a wafer-expansion capability within the bay andprior to positioning the wafer in the feeder. Similarly, one of theregions within bay 116 may include an ultraviolet (UV) light exposurestation, where a wafer is inserted into the station prior to beingloaded into one of the die feeders 130. Another possible pre-processingstation would be a mapping station where the wafer may be scanned formissing or damaged die, or to confirm the presence of indicators (inkdots) on known bad die (KBD). Examples of post-processing operations, inaddition to storage, may be a station to remove the expanding rings fromthe spent wafer frame for subsequent reuse on the next wafer within thewafer expansion queue. And lastly yet another functional applicationwithin the storage bay region would be the ability to read specificencoded data, which references the actual component via a part numberand unique batch ID. The decoding means most generally employs theoptical imaging of bar codes however OCR and magnetics (e.g., magneticink character recognition) are acceptable alternatives. The decoding andsubsequent verification process can be exercised upon the loading of newcomponents into the bay as well as just prior to transporting thecomponents into the feeder.

[0027] As previously noted, and as depicted in FIG. 3, it is furthercontemplated that in the place of a plurality of wafers stored in bay116, a plurality of component storage units such as tape reels 122 maybe stored. In particular such a system may be used for the automatedreloading of a self-threading component tape type feeder such as thatdescribed in a co-pending U.S. Provisional Application No. 60/293,397for a “SELF-THREADING COMPONENT TAPE FEEDER” by Lyndaker et al.,previously incorporated by reference.

[0028] Also depicted in FIGS. 1 and 2 is a gripper assembly 150 forgripping one of the plurality of wafer frames 142 or component tapereels 122 stored in bay 116. The gripper assembly is moved from aposition adjacent the storage bay to a position adjacent the componentfeeder 130 via gripper assembly movement means 124 that includes aplurality of translatable slides, and drive mechanisms associatedtherewith, positioned along at least two and preferably three axes (X, Yand Z as shown in the figures).

[0029]FIG. 1 further depicts a user-interface display 132 associatedwith the system 100. Preferably, the display 132 is a touch-screen typedisplay (displays an image and is responsive to a user's touching of thedisplay screen) that may be used in conjunction with the interchangesystem, and its control logic and circuitry (FIG. 6) to support one ormore of the following features/functions:

[0030] (a) Teaching and calibration of the interchange system as well asthe feeding apparatus can be controlled via icons on the screen;

[0031] (b) Communicate status or errors to a user via the displayscreen;

[0032] (c) Video output from the component feeder may be directed to thetouch screen in lieu of an on-board viewer;

[0033] (d) Provide on-line documentation such as a service and/or anOperator's Manual;

[0034] (e) Provide a diagnostics interface for troubleshooting thesystem;

[0035] (f) Provide an operator interface during operation of the system.

[0036] It is further contemplated that the component source interchangesystem may be interconnected or networked with the component feedersand/or the printed circuit board assembly systems they support, wherethe display 132 may be adapted to display data or other informationassociated with other systems and components in communication with thecomponent source interchange system 100.

[0037] Referring next to FIGS. 1 and 4, the process for moving thegripper assembly 150 relative to bay 116 and component feeder 130involves the activation of the drive mechanism for at least one axis andpossibly multiple axes concurrently. Motion along the X-axis isregulated by a pair of slides or rails 160, wherein a carriage 162, towhich gripper assembly 150 is attached, is moved under the control of alinear actuator such as a screw-type drive 162, driven by a drive motor166 operatively associated with the screw drive via a belt 168 andpulley assembly 170. Rotation of the drive motor 166 results in therotation of the screw drive and the displacement of carriage 162 alongthe slides 160. As will be described below, operation of the drive iscontrolled as a function of the position of the carriage, such positionbeing monitored in accordance with the engagement of the drive motor. Ifa stepper motor is employed as the drive motor, it may be possible toaccurately control the X-axis motion without the need for real timeposition sensing feedback.

[0038] Similarly, the motion of the gripper assembly relative to theY-axis is controlled by a linear slide 176. However, for this directionthe position of a carriage 178 along the slide is controlled by themovement of a drive belt 180 operatively affixed to the carriage. Drivebelt 180 is, in turn, driven in response to the rotation of pulleyassembly 182 operatively coupled to drive motor 184.

[0039] Lastly, the Z-axis motion of the gripper assembly 150 iscontrolled by a linear slide 190 oriented in a direction parallel to theZ-axis. A carriage 192 is slidably coupled to the Z-axis linear slide aswell as a drive belt 194. As with the Y-axis drive mechanism, a drivemotor 196, and pulley assembly 198 operatively coupled thereto, areemployed to control the movement of drive belt 194. Here again, stepper,servo, linear or similarly controlled motors may be employed toaccurately position each of the slides along the associated slides orrails, thereby controlling the ultimate position of gripper assembly 150in three directions.

[0040] Control and logic circuitry, including a stepper motor controller280 (FIG. 6) are contained within housing 200, which is operativelyconnected to frame 114. Control of system 100 is preferably accomplishedusing a general purpose programmable controller 260 (FIG. 6) equippedwith multiple i/o ports for sending and receiving from the varioussensors and motion control devices As a result of the control circuitrya gripper assembly 150, with a wafer frame 142 grasped therein, may bemoved in a generally continuous fashion from a position adjacent thestorage bay 116, where a wafer frame is extracted from the storagemagazine, to a position in proximity to the component feeder (loadlocation) where the wafer frame may be automatically inserted into thefeeder 130 for use.

[0041] Those skilled in the art of robotic equipment design willappreciate that there are numerous alternative configurations for thegripper assembly movement means, including single-arm robots and othermechanisms to reliably and accurately position the wafer gripperassembly relative to the storage bay 1 16 and the feeder(s) 130. It willbe further appreciated that various shields and covers may be placed onthe gantry apparatus during operation so as to shield the wafers and diefrom dust, and to prevent the apparatus from being tampered orinterfered with during operation. Such covers may further provide safetyprotection by preventing operators from contact with the moving gripperassembly and other components of the component source interchange gantry100. It is further contemplated that the covers and shield may be anintegral part of the gantry frame 114, and that one or more of suchcovers and shield may employ casters or wheels so as to provide supportto the gantry frame during use or when the gantry frame is in an openedstate.

[0042] Turning now to FIG. 5, there is depicted an illustration of thevarious components of the gripper assembly 150. The gripper assemblyincludes a mount 206 for attaching the gripper assembly to the gripperassembly movement means, preferably a carriage that travels along alinear slide as described above. Mount 206, as depicted in the figure,includes a magnetic coupling surface 208 that, during operation of thesystem, is coupled to an opposing surface on the bottom of the Yaxiscarriage 178 (FIG. 4). One or more alignment pins 210 achieve alignmentof the mount 206 with the carriage 178, and corresponding receptacles onthe opposing surface (not shown). The magnetic coupling is preferably apermanent magnet, and provides a breakaway mount should the gripperassembly come into contact or interference with another piece ofequipment. Furthermore, tether 174 in FIG. 4 is included to prevent themount and gripper assembly from falling to the floor beneath the systemin the event they mount is decoupled.

[0043] Assembly 150 further includes opposing clamping members 214 and218 that are pivotably attached to one another by hinge 222. Theclamping members are biased against one another by a plurality ofsprings 224 along the rear edge of members 218. Under the control ofpneumatically operated actuators 230 and 234, the separation of themembers 214 and 218 is controlled. It will be appreciated that in orderto control the position of the clamping members relative to one another,it is preferable that actuators 230 and 234 are positioned on theopposite side of the hinge from the springs 224. Furthermore one or moresensors 238 (optical or manual switch type) may be employed inconjunction with the clamping members 214 and 218 to determine or verifythe presence and position of a wafer frame or component tape reel whenone is to be retrieved by “closing” members 214 and 218 of the grippingassembly 150.

[0044] Referring briefly, to FIG. 6, there is illustrated a generalschematic diagram showing the control circuitry for system 100. Inparticular, a system controller 260 receives input from a plurality ofsensors such as door sensors 264, from the touch screen user interfacedisplay 132, and from the host machine (input line 268—e.g., Ethernet ora similar network protocol). In response to a set or pre-programmedinstructions and the various inputs or programmatic variables, systemcontroller 260 operates the component source interchange gantry system.Operation of the system includes not only the control and monitoring ofthe gantry drives (drive controller 280 and drives 166,184 and 196), butalso of the system pneumatics such as the pneumatic wafer gripper (block150, having actuators 230 and 234 as depicted in FIG. 5) and optionalpre- or post-processing equipment 272 in bay 116 (not shown).Accordingly, system 100 is provided as a turnkey system that may befully integrated with new or existing assembly systems and associatedcomponent feeders.

[0045] Referring again to FIG. 2, the details of latch mechanism 120will be discussed. Latch 120, as shown, may be an electromagnetic latch,wherein the application of power to the electromagnets within the latchcause the latch to remain coupled to a magnetic surface such as surface121 positioned on frame 102 directly opposite the magnetic latch.Alternative latching mechanisms such as a catch or clasping mechanismmay be employed, so long as the mechanism serves to assure that both ofthe pivot points (110 and 112) are completely closed in order for thelatch to engage. The required functionality of latch 120 may be providedby a pneumatically actuated latch, whereby the latching mechanism ispneumatically operated via an actuator and an associated valve assembly(not shown). Furthermore, latch 120 may include an associated switch orsensor, wherein a failure to latch, unlocking or opening of the latch,will disable the system from automated operation. Such a feature isbelieved to be a safety feature that will not only prevent possibleinjury to a user, but will also prevent the unintended damage of systemcomponents were the system to be operated when the gantry and bayassemblies are open.

[0046] Referring lastly to FIG. 7, there is depicted a basic flowdiagram illustrating the various general steps accomplished by thepresent invention in an embodiment where it is configured to operatewith one or more direct die feeders (DDF). Beginning with Step 300, thesystem receives a signal from the DDF that the current wafer has beenexhausted of die. After receiving the signal, the gripper assembly ismoved to a position adjacent the DDF load position, step 304, where thegripper is able to retrieve the exhausted wafer, step 308. Once thegripper has gripped and retrieved the exhausted wafer at step 308, asverified by a wafer frame sensor on the gripper (not shown), the gripperassembly is moved using the X-Y-Z axes (step 312) to a position wherethe wafer frame can be deposited in an open slot in the wafer bay, step316.

[0047] Having retrieved and deposited the exhausted wafer frame, thegripper assembly next moves to a full wafer slot in the bay, step 320,and grips the wafer frame so as to extract the full wafer frame from thebay, step 324. Subsequently, the gripper assembly is moved, again viathe X-Y-Z axes to a position adjacent the DDF load position, step 328.The full wafer frame is deposited into the DDF, step 332, and thecomponent source interchange gantry system automatically sends a signalto the DDF (and/or the host machine) indicating that a new wafer isavailable and then waits for a signal that another fetch and retrievecycle is necessary, step 336.

[0048] In recapitulation, the present invention is a method andapparatus for automatically storing and replenishing a source ofcomponents (e.g., expandable wafers used in a direct die feeder such asthe Hover-Davis Direct Die Feeder and component tape reels). In the massproduction of printed circuit boards automated pick-and-place equipmentaccepts die from “chip” or component feeders and then mounts them at apredetermined location on the circuit board. The present inventionincludes a storage bay and a gripping assembly that is moved by a gantryrobot to retrieve a wafer or reel from the storage bay and automaticallydeposit the wafer into a component feeder.

[0049] It is, therefore, apparent that there has been provided, inaccordance with the present invention, a method and apparatus forstoring and automatically replenishing a component source in associationwith a component feeding system. While this invention has been describedin conjunction with preferred embodiments thereof, it is evident thatmany alternatives, modifications, and variations will be apparent tothose skilled in the art. Accordingly, it is intended to embrace allsuch alternatives, modifications and variations that fall within thespirit and broad scope of the appended claims.

What is claimed is:
 1. An apparatus for supplying component storageunits to a component feeder, comprising: a frame for positioning theapparatus in juxtaposition with the component feeder; a storage baylocated within the confines of said frame for storing a plurality ofcomponent storage units therein; a gripper assembly for gripping one ofthe plurality of component storage units stored in said storage bay; andgripper assembly movement means for automatically moving the gripperassembly from a position adjacent the storage bay to a position adjacentthe component feeder.
 2. The apparatus of claim 1, wherein said gripperassembly includes: a mount for attaching the gripper assembly to thegripper assembly movement means; and a pair of opposed clamping membersfor releasably clamping the expandable wafer.
 3. The apparatus of claim2, wherein said mount is a breakaway mount to prevent damage to thegripper assembly or the gripper assembly movement means in the event ofinterference.
 4. The apparatus of claim 3, wherein said breakaway mountincludes a pair of magnetized surfaces oriented in opposition to oneanother, and an alignment mechanism to assure proper alignment of thegripper assembly and the gripper assembly movement means when they areassembled.
 5. The apparatus of claim 2, wherein said gripper assemblyfurther includes: a spring for biasing the opposed clamping memberstoward one another; an actuator operatively opposed to said spring,wherein the actuator operates to separate the opposed clamping memberswhen actuated; and a sensor operatively associated with at least one ofsaid clamping members to indicate the presence of an expandable waferbeing gripped by the opposed clamping members.
 6. The apparatus of claim1, further including means for moving at least said gripper assemblyaway from the component feeder so as to allow access to the componentfeeder.
 7. The apparatus of claim 6, wherein said means for moving atleast said gripper assembly away from the component feeder includes: atleast one pivot point along a first side of said frame so that theapparatus may be swung away from, and thereby allow access to, thecomponent feeder.
 8. The apparatus of claim 6, further including: alatch for releasably retaining said frame in an operating positionjuxtaposed to the component feeder.
 9. The apparatus of claim 8, whereinsaid frame further includes: a frame support for releasably supportingsaid frame in an operating position juxtaposed to the component feeder.10. The apparatus of claim 1, further including a user-interface displayfor depicting at least one indicator as to the status of operation ofthe system.
 11. The apparatus of claim 1, further including a processingstation, located within said storage bay, whereby a component storageunit may be automatically placed within said processing station by saidgripper assembly.
 12. An apparatus for supplying wafers to a direct diefeeder, comprising: a frame for positioning the apparatus injuxtaposition with a direct die feeder; a wafer bay located within theconfines of said frame for storing a plurality of wafers therein; agripper assembly for gripping one of the plurality of expandable wafersstored in the wafer bay; and gripper assembly movement means for movingthe gripper assembly from a position adjacent the wafer bay to aposition adjacent the direct die feeder.
 13. The apparatus of claim 12,wherein said gripper assembly includes: a mount for attaching thegripper assembly to the gripper assembly movement means; and a pair ofopposed clamping members for releasably clamping the expandable wafer.14. The apparatus of claim 13, wherein said gripper assembly furtherincludes: a spring for biasing the opposed clamping members toward oneanother; an actuator (air operated) operatively opposed to said spring,wherein the actuator operates to separate the opposed clamping memberswhen actuated; and a sensor operatively associated with at least one ofsaid clamping members to indicate the presence of an expandable waferbeing gripped by the opposed clamping members.
 15. The apparatus ofclaim 12, further including: means for moving at least said gripperassembly away from the direct die feeder so as to allow access to thedirect die feeder and a host to which the direct die feeder isoperatively attached; and a latch associated with said frame forreleasably retaining said frame in an operating position juxtaposed tothe direct die feeder.
 16. A method for automatically supplyingcomponents to a component feeder, comprising the steps of: positioning acollection of component storage units in a bay in juxtaposition with acomponent feeder; releasably gripping a component storage unit in thebay; and moving the component storage unit from a position within thebay to a position adjacent the component feeder to facilitate theautomatic insertion of the component storage unit into the feeder foruse.
 17. The method of claim 16, further comprising the steps of:releasably gripping a component storage unit in the component feeder;removing the component storage unit from the component feeder; movingthe component storage unit to an open position within the bay; andinserting the component storage unit into the open position within thebay.
 18. A method for automatically supplying wafers to a direct diefeeder, comprising the steps of: positioning a collection of wafers in awafer bay in juxtaposition with a direct die feeder; releasably grippinga wafer stored in the wafer bay; and moving the wafer from a positionadjacent the wafer bay to a position adjacent the direct die feeder tofacilitate the automatic insertion of the die into the feeder for use.19. The method of claim 18, further comprising the step of: verifying,subsequent to the step of releasably gripping a wafer stored in thewafer bay, that a wafer has been gripped.
 20. The method of claim 18,further comprising the step of: sending a signal to the direct diefeeder to indicate that a new wafer is available.